KSR Institute For Engineering And Technology Latest News & Notifications 2025 ,Namakkal

Placements: Placements are improving every year. For biomedical, few core companies come, but we get more chances in IT. Training is given for aptitude, group discussion, and interview. If we prepare well, getting placed is possible with a good package. Overall, good placement only.

Placements: More than 90% of students got placement last year. In the last year, nearly 70% of students got internships from the company. Top recruiting companies are WIPRO, TCS, Accenture, and CRI Pumps. The highest LPA is 21, and the lowest LPA is 4.

Placements: In my college, more than 75% of students got placements in the last year. The highest package in my college is 20 LPA, and the lowest package is 4 LPA in the campus interview. The top companies for my courses are Infosys, TCS, Accenture, Wipro, and Bosch. In the last year, 80% of students got internships by the companies. The top roles offered by companies are electrical engineer, electronic engineer, and power system engineer.

Placements: More than 90% of students got placement in the last year. Nearly 80% of students got the internship from companies like core and non-core companies. Top recruiting companies are TCS, Wipro, and Corizo Cri Pumps. The highest package is 21 LPA and the lowest package is 4 LPA.

Placements: More than 70% of students got an internship while pursuing their final year degree. Most students get placements through their internship companies. In my last year, nearly 80% of students got placed. Top recruiting companies are Wipro, TCS, Corizo, Infronex, Cluster, and more core branch companies. Top roles offered by the company to the students are co-worker and manager-level positions.

Placements: Students get placed in highly reputable companies. More than 80% of students got placements. The top recruiting companies for our course are TCS, Google, and Wipro. More than 65% of students got internships in companies. The top roles offered by companies are co-workers.