Malla Reddy University Powered by Emversity Scholarship Details ,Bahadurpally, Hyderabad

Placements: Around 90% of students in the Artificial Intelligence and Data Science course at Sri Indus College of Engineering and Technology get placed. Packages range from 3 to 20 LPA. The highest package reported is approximately 20-25 LPA, with an average package ranging from 3.5 to 6 LPA. The lowest package is 3-4 LPA. Top recruiting companies include industry leaders like TCS, Infosys, Wipro, Amazon, Google, and Cognizant. Around 60 percent of placements include companies like TCS, Infosys, Cognizant, ...

Placements: 70-85 percent are placed in my college, with 3.45 LPA. The companies in my college are Infosys, TCS, Accenture, Amazon, and some other companies, with 80 percent percentage. Maximum employee jobs only we got. In interviews, some companies are just asking about the basic topics.

Placements: Only about 10 percent of the students got placed, which is very low for the students studying here and graduating from here. The lowest package is 2 LPA. Infosys is the top company recruiting. Internships are based on the course students choose. Internships are more for Master's students because there are fewer people studying those courses.

Placements: In our college, there are 80% of placements offered. Many big MNC companies visit the campus. Many students get many placement offers. In different courses, we get many placements. 50% of students in our course are placed very well, with many good offers.

Placements: 75% students are placed in our college. Highest package in our college is 25 LPA. The lowest package is 10 LPA. Many companies are linked to our college. The 80% of students got placements in our college. Amazon, Infosys, and other companies are liked.

Placements: There are not many placements on our campus. The highest package is 20 LPA, and the lowest package is 5 LPA. Very few recruiting companies for our course. Not many students secured internships from our course, and there are no top roles available.