Maharana Pratap Engineering College Scholarship Details ,Kanpur

Placements: Placements are mostly 85-90% of students got placed. The highest package is 45 LPA, and the lowest got 1.9 LPA in the previous session, and the average package went up to 3-3.5 LPA. From technical roles to business development, and also ed-tech roles are usually seen in previous records, but are not limited to that. Internships are totally dependent upon the student and technical department collaboration; however, if someone cracks the off-campus, the institute allows the students to follow thei...

Placements: Almost 90% or more than that are placed. The highest package is 49 LPA, and the average package is 6 LPA. Top companies for my course are Microsoft, Google, Amazon, Razorpay, and some more. The percentage of getting internships is better.

Placements: Placement percentage for my college is around 90%. Top recruiting companies are Accenture, HCL, and TCS. The highest package is 49 LPA, the average is 6 LPA, and the lowest is 7 LPA. The top roles offered by this course are SDE, data analyst, business analyst, etc.

Placements: More than 78% students get placed every year. Highest package at my college is 49 LPA, and average package is 6 LPA. Top recruiting companies are TCS, Accenture, and HCL Tech. Top roles offered are Software Developer, QA Engineer, and Data Analyst.

Placements: In the 2023-24 placement season, MPEC reported the highest salary package of INR 49 LPA, with an average package of INR 4.3 LPA. College achieved a placement rate of approximately 90%, with top recruiters including Microsoft, Wipro, TCS, Deloitte, and Infosys. Placements are very good at the college. Most of my friends are placed in the third semester.

Placements: The college has a decent placement record, especially for engineering students and management students. Moderate packages, scope for improvement in career job opportunities, and to showcase talents and soft skills. There is an industry-relevant curriculum, and room for more cutting-edge courses.