JECRC University Scholarship Details ,Jaipur

Placements: I have seen that the highest package offered is 18 LPA. The lowest package offered is 6 LPA. The level of placements is high. Placements are more then 95%. Almost everyone who depends on the college to get a placement gets it.

Placements: We have a very good source of education, and the placement criteria are also good. The percentage you require to take admission is 60 percent. They have many companies that are recruiting. The top packages offered in our college are like 16 LPA to 20 LPA. We have all top companies.

Placements: It only helps the toppers students and students who have opted for CRT, and the college has top companies as recruiters, but the criteria are not very clear, which makes it a bit confusing and not convenient for the students. However, it is a good choice for the students.

Placements: I am a first-year student, so I don't know much about the placement scene. I know that 70-80 percent of students who have a good GPA get placed. Roughly 45-60 percent of students secured internships. The highest package offered is around 33 LPA in phase 1. The average package offered ranges from 6-7 LPA. Top recruiting companies like TCS, Accenture, TISCO, Cognizant, IBM, and HP hire students from the college. Top roles offered are software developer, full-stack developer, network engineer, etc.

Placements: For B.Tech you have plenty of options. My seniors are well placed in different companies. You need to work on yourself for better placement opportunities. You can get an average package of 5 LPA easily if you work on yourself. Currently, the placement ratio is improving and also increasing.

Placements: I didn't opt for CRT, hence I didn't sit in placements either. I wanted to pursue motion graphics and animation. Otherwise, the college makes sure to stay with the students in their journey of getting placed. I'd say about 60% student get placed for sure rest either drop from the placements, want to pursue something else, or pursue higher education.