IIIT Hyderabad Scholarship Details ,Gachibowli

Placements: IIIT Hyderabad consistently records excellent placements, as 95-99 percent of students get placed each year. In the B.Tech CSE course, the highest package recently touched is 128 LPA. The average package ranges from 32-34 LPA. The lowest package is 6 LPA. Major recruiters include Google, Microsoft, Amazon, Apple, Adobe, Meta, Uber, Goldman Sachs, and top product companies. Most roles offered are software engineer, research engineer, ML/AI, system developer, and security. Internship statistics ar...

Placements: About 97% of students were placed in my course, with the highest being 74 LPA and the lowest being 12 LPA, with an average of 27 LPA. Some of the top companies include Amazon, Qualcomm, and Google. Almost everybody in our course got the internship; it is somewhere around 99%.

Placements: This year, i.e, 2025, 100% of registered students are placed. The highest package is 18 LPA, the lowest is 12 LPA, and the average is 15 LPA. Many of the students got PPOs, which are not considered in official placement states. These include companies like Uber, Microsoft, Goldman Sachs, and Google.

Placements: At least 70% of students got placed. Nearly 40 LPA is the package offered. Many students go abroad to pursue higher studies. Many students got an internship. Some individuals got to CERN too. You can work as a TA to earn money in your third year or above, too. For the CND course, recruiters sometimes have a science background too.

Placements: Our college offers courses like B.Tech in Computer Science, Master's in Data Science, and MS in Research. Many students from the UG background will get internships in top companies, and it is somewhat difficult in some areas like a master of science in data science. The course structure is not aligned properly, which causes students to face trouble during placements. Furthermore, courses in B.Tech and M.Tech are good. It can be recommended if anyone is interested in technical skills and would li...

Placements: 97% students placed in our electronics and communications engineering batch. Highest package is 36 LPA, and lowest package is 12.36 LPA based on 2024-2025 placements. Qualcomm, Nvidia, Texas Instruments, Microsoft, Goldman Sachs, Uber, Samsung, Amazon, and Oracle are recruiters. At least 40-50 % students got internships during their course. Roles offered are Analog and Digital Design Engineer, RTL and VLSI engineer, machine learning engineer, SDE, SWE, hardware and embedded systems engineer.