Discontinued(AUG-2022)-B.Tech. in Electrical Engineering 

at SPSU, Udaipur

The BTech Mechanical Engineering syllabus is not the same across all colleges, as every college committee sets a particular coursework pattern at the start of every academic year to be followed for the respective batch. The syllabus includes some core subjects, interesting electives, and lab work that gives detailed knowledge to the students about the workings of the field.

Helpful Link: Mechanical Engineering Subjects in Detail

The University has released the highest package for the School of Engineering (SoE) and School of Management (SoM). The overall the highest package for 2023 stood at INR 13.40 LPA. The table below depicts the SPSU Udaipur the highest package:

According to unofficial sources, a large share of Sir Padampat Singhania University alumni is placed in the Engineering sector with a 28% share. The detailed sector-wise distribution is illustrated in the pie chart below:

NOTE: The sectors involved in the 'Others' category are Media and Communication, Program and Project Management, Finance, Administrative and Quality Assurance.

The list of leading companies that were part of Sir Padampat Singhania University placements in recent years is presented below:

The overall average package for the academic year 2022-23 stood at INR 4.30 LPA for the School of Engineering and the School of Management. Tabulated below are the SPSU Udaipur average package details for 2023:

The highest package offered to SoM and SoE students during the 2023 drive was INR 10 LPA and INR 13.40 LPA, respectively. The overall average package for both the Schools was the same. The following table mentions the Sir Padampat Singhania University placement package 2023:

As per the latest report, 51.30% of SoE and 46.70% of SoM students received multiple job offers during 2023 placements. In addition to this, 43.60% of SoE and 33.30% of SoM students received packages above INR 4 LPA. The complete insights of SPSU Udaipur placements 2023 are mentioned below: