RTMNU Scholarship Details ,

Placements: In 2024-25, the percentage of students placed in Electronic and Telecommunication Engineering is 93%. The total placed students are 852%. The highest package is 11.88 LPA, while the average package is from 3 to 6.5 LPA, and the lowest package is from 3 to 4 LPA. There are many top recruiting companies like LTTS, Capgemini, Cognizant, HCL, JSW, and Reliance Industries. 100% of students got internships from the Electronic and Telecommunication Engineering branch. The top roles are VLSI Engineer, E...

Placements: The top recruiting companies include Mahindra and Quick Heal. Around 50 percent of students from the senior batch secured internships in companies such as Mahindra and Quick Heal. The highest package offered is 12 LPA. The lowest is 2 LPA, with an average package of around 6–8 LPA. Top roles offered include positions such as technician and network architect.

Placements: In the year 2025, I only see two placement drives in my college that will be conducted by the training and placement department, and only a few people are getting placed. The college is good, but it can improve itself in areas like the labs and teachers' experience.

Placements: Nearly 40-50% of students get placed in our college. The highest package was 6 LPA, and the lowest was 3.25 LPA. The top recruiting company is Ernst and Young. Our placement cell offers various internships that depend on students who grab them. The top role in my course is the manager of a firm.

Placements: In terms of placements, our college is not that good. Low companies come to our college. The package offered is very low. Mostly, students get off-campus placements. It is not that good for on-campus placements.

Placements: Students who paid attention during placement got placed, so 35 percent of students got placed. The lowest package is 4.5 LPA and the highest is 8 LPA. Companies like Eaton and Deutsche Bank actively hire in campus. The role offered is a finance analyst, and tech companies also come to hire BCA students.