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Reviews (Showing 6 of 19594 reviews)

Overall Rating (Out of 5)

4.0

Based on 16193 Verified Reviews

Distribution of Rating

Component Ratings (Out of 5)
Placements
3.9
Infrastructure
4.0
Faculty & Course Curriculum
4.1
Crowd & Campus Life
4.1
Value for Money
4.0
The Verified badge indicates that the reviewer's details have been verified by Shiksha, and reviewers are bona fide students of this college. These reviews and ratings have been given by students. Shiksha does not endorse the same. Out of 19594 published reviews, 16192 reviews are verified.
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A
A JOSELIN AMALA | B.E. in Computer Science and Engineering - Batch of 2019
Offered by Pavendar Bharathidasan College of Engineering and Technology - PABCET
Reviewed on 21 May 2026
Verified
4.8
Placements 5 Infrastructure 5 Faculty & Course Curriculum 5 Crowd & Campus Life 5 Value for Money 4
Good infrastructure and facilities.

Placements: More than 10 companies came to our college and recruited more than 100 students from the department of CSE. The good packages were offered to selected students. Students were placed in good positions in the IT sectors and also in ITES companies.

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A
Anushiya R | B.E. in Computer Science and Engineering - Batch of 2026
Offered by J.J. College of Engineering and Technology
Reviewed on 2 May 2026
Verified
5.0
Placements 5 Infrastructure 5 Faculty & Course Curriculum 5 Crowd & Campus Life 5 Value for Money 5
JJCET – A great college for study.

Placements: The placements are very good from a student’s point of view. Around 75% of students are placed in well-known companies. The highest package is 13 LPA, the average package is 9 LPA, and the lowest package is 6 LPA.

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R
Ram Viswanath | B.Tech. in Artificial Intelligence and Data Science - Batch of 2028
Offered by Ramco Institute of Technology
Reviewed on 8 Aug 2025
Verified
2.6
Placements 3 Infrastructure 3 Faculty & Course Curriculum 2 Crowd & Campus Life 2 Value for Money 3
There is less scope.

Placements: About 40% of students have been placed each year. The highest package is up to 6 LPA, and the lowest is 2 LPA. Top roles are AI&this and ECE. Top recruiting companies are HCL, Zoho, Wipro, Ramco Systems, etc. Around 50 students get an internship from AI&this department. Top roles are offered at the very beginning level only.

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R
Rubiga P | B.E. in Computer Science and Engineering - Batch of 2026
Offered by J.J. College of Engineering and Technology
Reviewed on 2 May 2026
Verified
5.0
Placements 5 Infrastructure 5 Faculty & Course Curriculum 5 Crowd & Campus Life 5 Value for Money 5
Better infrastructure compared to other colleges.

Placements: College has great placement achievements. Around 85% of students placed in well-known and GCC companies. Top companies visit the campus for recruitment. The highest package offered is 17 LPA, and the lowest package is 6 LPA.

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D
DEVI S | B.E. in Computer Science and Engineering - Batch of 2026
Offered by J.J. College of Engineering and Technology
Reviewed on 2 May 2026
Verified
5.0
Placements 5 Infrastructure 5 Faculty & Course Curriculum 5 Crowd & Campus Life 5 Value for Money 5
The college provides good transport facilities and faculty members.

Placements: I am a Computer Science student from the 2026 batch. I chose this because I am interested in computers and technology. The highest package is 8 LPA. The lowest package was 3.6- 4 LPA in the previous batch. Many well-known companies, HCL and TCS, along with AI-related companies, visit the campus for placements.

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F
Farhan hameed s | B.Tech. in Civil Engineering - Batch of 2028
Offered by Dhanalakshmi Srinivasan College of Engineering,Coimbatore
Reviewed on 14 Jul 2025
Verified
2.6
Placements 3 Infrastructure 2 Faculty & Course Curriculum 3 Crowd & Campus Life 2 Value for Money 3
My experience at DSCE Coimbatore.

Placements: Placements require students to be very much fluent in their communication skills. They have cleared all their semester exams without failing which means no back papers. They have at least 75 % CGPA to get placement, only one out of 300 students gets 12 LPA and more package jobs.

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